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A semi-automatic grinding machine for chamfering the outer peripheral edge of a wafer in a simple manner.
Compatible with wafers from φ2 inches to φ6 inches. Supports various materials including Si, glass, SiC, oxides, and compound wafers. Miniaturized for use in research, development, and prototyping processes.
Leave the chamfering of carbide round bars such as mold punches and knock pins to us.
The TMC080 model is an easy-to-operate, simple beveling machine equipped with a dust collector, ensuring that the workspace remains clean. It is also possible to re-sharpen the beveling cutter, which improves the quality of the processed surface. Please feel free to consult us if you have any requests. 【Features】 ■ Very easy to operate ■ Keeps the workspace clean ■ Re-sharpening of the beveling cutter is possible ■ Improves the quality of the processed surface *For more details, please download the PDF or feel free to contact us.
